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本课程涵盖了电子封装和组装应用中软钎焊焊点的可靠性表现。讨论了焊点的机械失效模式机制和提高可靠性的方法。在电可靠性方面，详细讨论了由于微型化的发展而导致的严重的焊点，铜柱以及再分布线的电迁移问题。在组件类型方面，详尽地回顾了P0P以及其他的底部终止组件封装方式，包括材料选择，工艺，可靠性，和提高可靠性的方法。介绍了环氧助焊剂这种具潜力的解决方法，并将其与其他解决方案进行比较。最后，以QFN热板设计为实例，讲授了回流焊中，特别是在PoP和其他更容易产生气孔的封装方式中气孔控制方法。这些控制方法包括在材料，工艺和设计方面的考虑。 What You Can Learn From This Course: This course covers the solder joint reliability performance for packaging and assembly applications. The mechanism of joint mechanical failure modes and approaches for improving reliability will be discussed. As to the electrical reliabilities, electromigration will be discussed in great details on solder, Cu pillar, and redistribution line due to the rapid advancement of miniaturization and the resultant serious electromigration problems. Regarding the ponent type, Package on package (PoP) as well as other bottom-terminated ponents will be reviewed thoroughly, including materials selection, processes, reliabilities, and approaches of enhancing the reliability. Being the solution with the highest potential, epoxy flux will be introduced and will be pared with other solutions. Finally, voiding control at reflow soldering, particularly at PoP and other packages more prone to have voids, will be instructed. The control includes considerations from materials, processes, and designs, with QFN thermal pad design serving as a demonstration on control. 【主办单位】中国电子标准协会ways
【协办单位】深圳市威硕企业管理咨询有限公司
【课程时间】2012年08月25-26日 深圳 【课程费用】2500元/人（含资料费、授课费、午餐）
【】李先生 彭
【报名】martin-. 谁应该参加此课程：
凡对电子封装和组装应用中实现焊点高可靠性（特别是对PoP封装）感兴趣的，并想了解如何实现的焊点高可靠性的人员均可参加本课程 Who Should Take This Course: Any one who care about achieving high reliability solder joints for packaging and assembly applications, particularly that of PoP, and like to know how to achieve it should take this course. 老师介绍：李宁成 Ning-Cheng Lee，1973国立台湾培训中心化学专业学士，1981年University of Akron子专业博士，现任美国Indium 公司技术副总裁。Ning-Cheng Lee博士于1986 年加入Indium 公司，在此之前，曾先后就职于莫顿化学公司 和SCM 公司。他对于T 行业中助焊剂和焊膏的研发有20 多年的经验，并在底部填充灌封胶和粘合剂的研发方面也具有极为丰富的经验。 Ning-Cheng Lee博士编写了 《Reflow Soldering Processes and Troubleshooting: T, BGA, CSP, and Flip Chip Technologies》（Newnes出版）1书，参与编写了《Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials》（McGraw-Hill出版），同时还编写了1些无铅焊接书籍的部分章节。他于1991年获T杂志颁发的佳I国际研讨会论文奖，1993年和 2001年获TA颁发的佳TA国际研讨会论文奖，2008年获IPC在美国APEX会议上颁发的论文奖， 2010年获TA China South颁发的佳论文奖，2002年，被提名为TA的荣誉会员，2003年获Soldertec全球无铅焊料奖， 2006年获CPMT杰出技术成就奖，2007年CPMT杰出讲师，2009年TA杰出作者，2010年获CPMT电子制造技术奖。Ning-Cheng Lee博士还是TA董事会成员，并担任《Soldering and Surface Mount Technology》和《Global T & Packaging》杂志的编辑顾问，《IEEE Transactions on Electronics Packaging Manufacturing》的助理主编。他发表过大量的文章，经常应邀参加国际研讨会并对1些研究成果做简短的介绍或者重要的演讲。 Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 20 years of experience in the development of fluxes and solder pastes for T industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973. Ning-Cheng is the author of “Reflow Soldering Processes and Troubleshooting: T, BGA, CSP, and Flip Chip Technologies” by Newnes, and co-author of “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials” by McGraw-Hill. He is also the author of book chapters for several lead-free soldering books. He received 1991 award from T Magazine and 1993 and 2001 awards from TA for best proceedings papers of I or TA international conferences, 2008 award from IPC for Honorable Mention Paper – USA Award of APEX conference, and Best Paper Award of TA China South 2010. He was honored as 2002 Member of Distinction from TA,ead Free Co-0peration Award from Soldertec, 2006 Exceptional Technical Achievement Award from CPMT, 2007 Distinguished Lecturer from CPMT, 2009 Distinguished Author from TA, and 2010 Electronics Manufacturing Technology Award from CPMT. He served on the board of governors for CPMT, serves on the TA board of directors. Among other editorial responsibilities, he serves as editorial advisory board of Soldering and Surface Mount Technology, Global T & Packaging and as associate editor for IEEE Transactions on Electronics Packaging Manufacturing. He has numerous publications and frequently gives presentations, invited to seminars, keynote speeches and short courses worldwide on those subjects at international conferences and symposiums.

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